Blind and Buried Vias for High-Speed PCB Design
In modern high-speed electronics—including 5G communication, servers, AI hardware, medical devices, and wearable gadgets—HDI PCB and signal integrity are no longer optional but mandatory design requirements. Traditional through-hole vias fail to meet the demands of miniaturization, fine-pitch BGA fanout, and GHz-level high-speed signal transmission. This is where blind buried via high speed pcb technology becomes…